Microstructures Evolution and Its Influence onMechanical Properties in Sn-Ag-Cu-Bi Lead-freeSolders After Aging Treatment
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Microstructures Evolution and Its Influence onMechanical Properties in Sn-Ag-Cu-Bi Lead-freeSolders After Aging Treatment
Acta Scientiarum Naturalium Universitatis SunYatseniVol. 42, Issue S1, Pages: 28-31(2003)
作者机构:
1. 大连理工大学材料工程系
2. 大连理工大学材料工程系,辽宁,大连,116024
3. ,辽宁,大连,116024
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Published:2003,
Published Online:25 December 2003,
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ZHAO Jie, QI Lin, WANG Lai, et al. Microstructures Evolution and Its Influence onMechanical Properties in Sn-Ag-Cu-Bi Lead-freeSolders After Aging Treatment. [J]. Acta Scientiarum Naturalium Universitatis SunYatseni 42(S1):28-31(2003)
DOI:
ZHAO Jie, QI Lin, WANG Lai, et al. Microstructures Evolution and Its Influence onMechanical Properties in Sn-Ag-Cu-Bi Lead-freeSolders After Aging Treatment. [J]. Acta Scientiarum Naturalium Universitatis SunYatseni 42(S1):28-31(2003)DOI:
Microstructures Evolution and Its Influence onMechanical Properties in Sn-Ag-Cu-Bi Lead-freeSolders After Aging Treatment